Abstract
Due to the strong influence of temperature rising on integrated circuits performance and reliability, an adequate thermal analysis of their cooling systems is required during chip packaging in order to prevent the thermal catastrophe. In this paper, we propose an approach based on RC compact model, which enables in one hand an approximation of dynamic thermal behaviour and in other hand the accurate temperature computation at any measurement point of parallel plate fin heat sink with U-shape channels. Farther more, we present the impacts of convection coefficient on heat sink surface temperature using a simplified approach, which enables the temperature computation by using the RC thermal compact model. Due to the convection coefficient change of surrounding environment, the surfaces and mass of parallel plate fin heat sink with U-shape channels were reduced while enhancing heat transfer capability.
References
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