Kasperek, Dariusz, and Anna Rudawska. “The Selected Aspects of Bus Assembly Process With Using Bonding Technology”. Technologia i Automatyzacja Montażu (Assembly Techniques and Technologies) 99, no. 1 (March 30, 2018): 20-25. Accessed October 6, 2024. https://czasopisma.prz.edu.pl/tiam/article/view/1033.